Method and apparatus of thermal detection using bonded coupon

Details Method and apparatus of thermal detection using bonded coupon Method and apparatus of thermal detection using bonded coupon

G - Physics

01

K

116/67

G01K 1/02 (2006.01) E21B 36/00 (2006.01) E21B 47/00 (2006.01)

Patent

CA 1218268

ABSTRACT OF THE DISCLOSURE A coupon is bonded to a component using a bonding agent which is capable of withstanding temperatures only up to a selected temperature above which the bonding agent no longer holds the coupon to the component. The component, during an operation, is intended for exposure to temperatures not above the selected temperature. An exposure of the component to the elevated selected temperature is identified by the fact that the coupon is no longer bonded to the component after termination of the operation. When the component is provided with insulation, the selected temperature is chosen to correspond to a temperature at which the insulation fails to determine the integrity of the insulation after the insulation. The coupon may be bonded to anexterior or interior surface of the component. With an exterior bonded component, visual inspection is sufficient. With an interior bonded component, detection means such as ultrasonic instrumentation is utilized to determine the presence or absence of the bonded component.

435498

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