Curing composition of polyether having reactive...

C - Chemistry – Metallurgy – 08 – L

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400/3008, 400/53

C08L 71/02 (2006.01) C08F 290/06 (2006.01) C08L 57/00 (2006.01) C08L 83/12 (2006.01) C08L 101/00 (2006.01)

Patent

CA 1237220

ABSTRACT OF THE DISCLOSURE A curing composition which comprises (A) a polyether having at least one reactive silicon-containing group in the molecule and (B) an acrylate polymer and/or an methacrylate polymer. The composition of the present invention has excellent weatherability, adhesive property, initial tackiness, especially at a low temperature, cohesive force, workability and stickness and is useful as a pressure sensitive adhesive, a sealing material, and the like.

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