C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3008, 400/53
C08L 71/02 (2006.01) C08F 290/06 (2006.01) C08L 57/00 (2006.01) C08L 83/12 (2006.01) C08L 101/00 (2006.01)
Patent
CA 1237220
ABSTRACT OF THE DISCLOSURE A curing composition which comprises (A) a polyether having at least one reactive silicon-containing group in the molecule and (B) an acrylate polymer and/or an methacrylate polymer. The composition of the present invention has excellent weatherability, adhesive property, initial tackiness, especially at a low temperature, cohesive force, workability and stickness and is useful as a pressure sensitive adhesive, a sealing material, and the like.
439242
Hirose Toshifumi
Isayama Katsuhiko
Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
Osler Hoskin & Harcourt Llp
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