Heat dissipation for electronic components on ceramic substrate

Details Heat dissipation for electronic components on ceramic substrate Heat dissipation for electronic components on ceramic substrate

H - Electricity

05

K

356/3

H05K 7/20 (2006.01) H05K 1/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1235528

ABSTRACT Disclosed is a heat dissipator for electronic components on a ceramic substrate. The ceramic plate receives heat from the component at one sur- face and has a plurality of separate spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate In a preferred embodiment the ceramic plate on which the metallic elements are mounted is separate from a ceramic substrate on which the electronic components are mounted; the ceramic plate carrying the metallic elements includes adhesive for adhering it to the ceramic substrate carrying the electronic components; the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.

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