Modular circuit board units mounted on printed circuit board...

H - Electricity – 05 – K

Patent

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H05K 1/14 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 3/32 (2006.01) H05K 7/10 (2006.01) H05K 1/00 (2006.01) H05K 3/00 (2006.01) H05K 3/36 (2006.01)

Patent

CA 1252909

INVENTOR: WALTER SCHMIDT INVENTION: MODULAR CIRCUIT BOARD UNITS MOUNTED ON PRINTED CIRCUIT BOARD FOR FORMING MODULE-IN-MODULE CONNECTION AND CIRCUIT ARRANGEMENT ABSTRACT OF THE DISCLOSURE A multilayer connection and circuit arrangement for integrated semiconductor and hybrid elements is disclosed. Modular units are arranged on at least one side of a support structure or element bearing a printed circuit board containing a number of recesses disposed in a matrix arrangement therein. The modular units are arranged in the matrix-like recess arrangement and are secured in a detachable manner on this support structure or element. Each individual modular unit is operatively interconnected with the printed circuit board of the support structure or element and comprises a, for instance, multi-layer printed circuit board on which a number of passive and/or active electrical components are disposed. These electrical components are operatively connected with the printed circuit board of the modular unit which is bonded by laminating to a base panel.

531538

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