Thermal conduction element for semiconductor device packages

Details Thermal conduction element for semiconductor device packages Thermal conduction element for semiconductor device packages

H - Electricity

01

L

356/113

H01L 23/34 (2006.01) H01L 23/433 (2006.01)

Patent

CA 1196110

Thermal Conduction Element For Semiconductor Device Packages Abstract A thermal bridge element for use in a semicon- ductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity. The bridge element has an axially compres- sible spring member with a bulged central portion, a first flat plate member adapted to be placed in contact with the device, a second flat plate member adapted to be disposed in contact with the cold plate or cover, and a means to maintain the spring member, the first plate member, and the second plate member in operative engagement.

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