Solder bonding material

Details Solder bonding material Solder bonding material

H - Electricity

01

L

356/146

H01L 23/488 (2006.01) B23K 35/26 (2006.01)

Patent

CA 1310764

SOLDER BONDING MATERIAL Abstract of the Disclosure Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.

613790

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