Method and apparatus for connecting thin plates

Details Method and apparatus for connecting thin plates Method and apparatus for connecting thin plates

B - Operations, Transporting

21

D

26/29

B21D 39/03 (2006.01) F16B 17/00 (2006.01)

Patent

CA 1266369

ABSTRACT OF THE DISCLOSURE A method and apparatus for performing the method, for connecting stacked thin plates 4, 5 (in par- ticular sheet-metal plates) or plate sections, according to which stacked flat parts 10, 11 of both plates are first deep drawn together with one another, after which the bottom area of the deep-drawn flat parts is swaged wider, and wherein the radial expansion of the bottom area of these deep-drawn flat parts is limited, as a result of which a plastic deformation of the material of the plate takes place, particularly in the peripheral area, so that a connection point is created. By means of a crimp 17 present in the peripheral area of the bot- tom 16 of the blind opening 3 of the die 2, the swaged material flows into itself at the point that are to be connected, and hence the clinching strength, is im- proved.

518162

Affiliated with

Also associated with

Rating

Method and apparatus for connecting thin plates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for connecting thin plates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for connecting thin plates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1274657