Physical vapor deposition dual coating apparatus and process

Details Physical vapor deposition dual coating apparatus and process Physical vapor deposition dual coating apparatus and process

C - Chemistry, Metallurgy

23

C

204/96.07, 204/1

C23C 14/22 (2006.01) C23C 14/32 (2006.01) C23C 14/35 (2006.01) C23C 14/50 (2006.01) C23C 14/54 (2006.01)

Patent

CA 1340811

A machine for covering a substrate by means of both cathodic arc plasma deposition (CAPD) and magnetron sputtering without breaking vacuum in a single chamber. A computer system monitors and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table used in conjunction with internal and external targets coats both sides of the substrate simultaneously.

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