C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/5907
C09J 163/00 (2006.01) B29C 65/02 (2006.01) B29C 65/54 (2006.01) C09J 11/00 (2006.01)
Patent
CA 1301396
61109-7529 ABSTRACT OF THE DISCLOSURE A new and improved one part, induction curable epoxy adhesive composition exhibiting storage stability at temperatures of a least 41°C for about two weeks, induction curable at temperatures of less than about 185°C in 6 seconds or less to a green strength of at least 200 psi, and exhibiting excellent full-cured physical and environmental properties is disclosed. The adhesive compositions are rendered induction curable by a combination curing agent comprising: (i) a latent high temperature curing agent, such as dicyandiamide; (ii) a latent intermediate temperature curing agent, such as HY940 or ANCAMINE ? 2041A; and (iii) a green strength enhancing agent comprising a finely divided thermoplastic resin powder selected from the group consisting of low density polyethylene, ethylene vinyl acetate, polystyrene, polyvinyl formal, polyvinyl butyral, poly(methyl meth- acrylate), NYLON-12, hot melt polyester resins and mixtures of any of the foregoing resins. The compositions are especially suited for fixturing oily galvanized metal parts in accordance with contemporary automobile manufacturing methods.
536251
American Cyanamid Company
Smart & Biggar
LandOfFree
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