Method of making contact to semiconductor device

Details Method of making contact to semiconductor device Method of making contact to semiconductor device

H - Electricity

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L

356/184

H01L 23/48 (2006.01) B23K 20/00 (2006.01) H01L 21/60 (2006.01)

Patent

CA 1220877

- 11 - METHOD OF MAKING CONTACT TO SEMICONDUCTOR DEVICE Abstract This invention is a method of manufacturing a semiconductor and involves making of an electrical contact to said device at low temperatures. The making of the electrical contact includes providing a contact material at the end of a wire positioned by a guide, said contact material being at a temperature near its melting point and touching the contact material to a desired contact point. The use of these steps results in low stress in the device.

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