C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/77
C23C 18/26 (2006.01) C23C 18/22 (2006.01) H05K 1/00 (2006.01) H05K 3/38 (2006.01) H05K 3/18 (2006.01)
Patent
CA 1331542
AN IMPROVED METHOD FOR PREPARING POLYMER SURFACES FOR SUBSEQUENT PLATING THEREON, AND IMPROVED METAL-PLATED PLASTIC ARTICLES Abstract An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electro- lytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.
600122
Dumas William Vincent
Foust Donald Franklin
Jerabek Elihu Calvin
Karas Bradley Ross
Lamby Edward John
Company General Electric
Craig Wilson And Company
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