Formaldehyde containing resins having low free formaldehyde

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/1311, 400/73

C08L 61/34 (2006.01) C09J 103/02 (2006.01) C09J 161/34 (2006.01)

Patent

CA 1337776

Formaldehyde containing resins used as curing, setting or crosslinking resins in a variety of natural product adhesives can be made with surprisingly low and novel levels of formaldehyde, can be made using reactants that can remove free formaldehyde from the resin solution or from the adhesive.

607520

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