Method of making particle boards

Details Method of making particle boards Method of making particle boards

B - Operations, Transporting

29

C

18/1009

B29C 39/02 (2006.01) B27N 1/00 (2006.01) B27N 3/06 (2006.01)

Patent

CA 1276767

ABSTRACT OF THE DISCLOSURE The present invention provides a method of making water- resistant particle boards by molding and adhering chips or flakes of wood or other vegetable fiber material together by the use of adhesive, the improvement comprising the step of heating said chips or flakes at a temperature of 100 °C to 200 °C at least for one hour in an atmosphere of 95% or more of incombustible gas while rotating said chips or flakes, whereby water and sap contained in said chips or flakes can completely be removed, prior to the adhering of said chips or flakes.

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