Epoxy-modified encapsulation composition

Details Epoxy-modified encapsulation composition Epoxy-modified encapsulation composition

G - Physics

02

B

400/2018, 18/908

G02B 6/44 (2006.01) C08F 291/00 (2006.01)

Patent

CA 1290482

ABSTRACT Epoxy-grafted, low molecular weight amorphous polymer compositions are employed in pourable, liquid electrical and/or electronic encapsulation compositions. Also disclosed is a method for encapsulating electrical and/or electronic circuitry.

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