Electronic device method using a leadframe with an integral...

Details Electronic device method using a leadframe with an integral... Electronic device method using a leadframe with an integral...

H - Electricity

01

L

356/143, 347/35

H01L 23/02 (2006.01) H01L 21/56 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1201819

ELECTRONIC DEVICE METHOD USING A LEADFRAME WITH AN INTEGRAL MOLD VENT MEANS ABSTRACT An improved ladder-type leadframe is described for use in connection with the plastic encapsulation of electronic devices, particularly semiconductor devices. The side rails of the leadframe, adjacent the die bonding flag, are grooved to provide, integral with the leadframe, a gas vent to relieve gas pressure inside the mold cavity during plastic encapsulation. By making the vent channels a part of the leadframe, rather than a part of the mold itself, as has been done in the prior art, the problems associated with mold vent blockage due to leadframe burrs, with cleaning the small vent channels found in a prior art mold, and with mold wear associated with those channels, are avoided. This reduces the cost of the molding operation, extends mold life, and improves product quality, and is accomplished without any significant increase in the cost of the leadframes.

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