Laser furnace and method for zone refining of semiconductor...

B - Operations – Transporting – 23 – K

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356/176, 356/192

B23K 26/00 (2006.01) C30B 13/24 (2006.01) C30B 13/28 (2006.01) H01L 21/00 (2006.01)

Patent

CA 1265207

ABSTRACT OF THE DISCLOSURE A method of zone refining a crystal wafer (116 Fig. 1) comprising the steps of focusing a laser beam to a small spot (120) of selectable size on the surface of the crystal wafer (116) to melt a spot on the crystal wafer, scanning the small laser beam spot back and forth across the surface of the crystal wafer (116) at a constant velocity, and moving the scanning laser beam across a predetermined zone of the surface of the crystal wafer (116) in a direction normal to the laser beam scanning direction and at a selectible velocity to melt and refine the entire crystal wafer (116).

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