Polyesterimide

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

31/163, 402/184,

C08G 73/16 (2006.01) H01B 3/30 (2006.01) H01B 3/42 (2006.01)

Patent

CA 1180488

ABSTRACT OF THE DISCLOSURE A low molecular weight polyester-imide resin is prepared wherein there is employed as the dibasic acid either 100% of the diimide dicarboxylic prepared by reacting two moles of trimellitic anhydride with one mole of methylene dianiline (the diimide is abbreviated DID) or oxydianiline or the dibasic acid can also contain a small percent of another aromatic acid. The product is used to produce coated wires having outstanding heat shock. The product also is useful to provide a top coat to wire coated with a polyester or with another polyester-imide.

392277

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