Photonic-integrated-circuit fabrication process

Details Photonic-integrated-circuit fabrication process Photonic-integrated-circuit fabrication process

G - Physics

02

B

88/97.7

G02B 6/12 (2006.01) G02B 6/124 (2006.01) G02B 6/136 (2006.01) H01L 21/8252 (2006.01) H01S 5/026 (2006.01)

Patent

CA 1326391

Abstract An improved process for fabricating photonic circuits is disclosed. The inventive process starts with a growth of a base wafer comprising a stack of epitaxial layers of various materials. At least a portion of each of the material layers will ultimately be a functioning part of any of a number of devices which will form the PIC or will serve a role in at least one of the fabrication processing steps. Specific inventive processing steps are addressed to interconnecting passive waveguides, active devices, and grating filtering regions without the substantial optical discontinuities which appear in the prior art, and etching continuous waveguide mesas to different depths in different regions of the PIC so as to optimize the performance of each PIC device.

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