Apparatus for die-bonding semiconductor chip

Details Apparatus for die-bonding semiconductor chip Apparatus for die-bonding semiconductor chip

H - Electricity

01

L

356/122, 356/193

H01L 21/00 (2006.01)

Patent

CA 1285079

ABSTRACT A process of die-bonding a semiconductor chip. The semiconductor chip is sucked by a collet and fixed on a preform which is formed on a die pad. A load is applied to the chip and a gas is blown around the semiconductor chip. The entire assembly is heated thereby curing the preform, In a preferred embodiment the semiconductor chip is sucked with the collet via a vacuum pump and an inert gas is blown around the semiconductor chip.

561782

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