Polypropylene-base resin composition

C - Chemistry – Metallurgy – 08 – L

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400/3079

C08L 53/00 (2006.01) C08K 3/00 (2006.01) C08K 5/14 (2006.01) C08L 23/16 (2006.01)

Patent

CA 1262387

- 27 - Abstract Disclosed herein is a polypropylene-base resin composition obtained by heating at a temperature of 170°C - 280°C a mixture containing a crystalline ethylene-propylene block copolymer having a specific composition, an ethylene-propylene copolymer rubber having a specific composition and viscosity, an inorganic filler having a specific particle size, and an organic peroxide, all in specified amounts. The thus-obtained polypropylene-base resin composition has high molding fluidity and are inexpensive and their moldings have excellent low-temperature impact resistance and paintability along with high stiffness. They are thus suitable for use in the production of large moldings such as automobile bumpers, fenders and body sidemembers.

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