Conductive lead arrangement

Details Conductive lead arrangement Conductive lead arrangement

H - Electricity

01

R

339/10, 356/2

H01R 4/02 (2006.01) H01R 43/16 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1286008

ABSTRACT A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive are of the first surface.

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