Thermosetting resin systems containing secondary...

Details Thermosetting resin systems containing secondary... Thermosetting resin systems containing secondary...

C - Chemistry, Metallurgy

08

L

402/15, 400/4101

C08L 101/00 (2006.01) C08G 59/50 (2006.01) C08G 77/26 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01)

Patent

CA 1296466

THERMOSETTING RESIN SYSTEMS CONTAINING SECONDARY AMINE-TERMINATED SILOXANE MODIFIERS Abstract of the Disclosure Modified heat-curable resins having enhanced tough- ness are prepared through incorporation of certain secondary amine terminated organosilicones or prereacts of these organo- silicones with epoxy, cyanate, or bismaleimide resins. These modified resins are useful as toughened matrix resins, as high temperature, high strength elastomers, and, particularly, as structural adhesives. -47-

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