Production of copper-clad dielectric boards

Details Production of copper-clad dielectric boards Production of copper-clad dielectric boards

H - Electricity

05

K

204/36, 204/9

H05K 3/00 (2006.01)

Patent

CA 1311210

ABSTRACT Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.

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