Electroless nickel initiator solution and process for...

Details Electroless nickel initiator solution and process for... Electroless nickel initiator solution and process for...

C - Chemistry, Metallurgy

23

C

6/4

C23C 18/54 (2006.01) C23C 18/18 (2006.01) C23C 18/28 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1232104

Abstract of the Disclosure An aqueous initiator solution and process for rejuvenating such initiator solutions and for prolonging the useful operating life thereof by which copper and copper alloy substrates are treated therein to render them receptive to a subsequent electroless nickel plating step. The detrimental effects of progressive contamination of such aqueous initiator solutions with metal ion complexing agents during commercial use and/or precipitation of the noble metal ions which progressively impairs the operativeness of such activator solutions is overcome in accordance with the present invention by the addition of controlled amounts of ferric ions effective to maintain at least a sufficient portion of the noble metal ions in solution in a noncomplexed condition whereby the initiator solution is effective to pretreat the copper substrate prior to electroless nickel plating.

468840

Affiliated with

Also associated with

Rating

Electroless nickel initiator solution and process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless nickel initiator solution and process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless nickel initiator solution and process for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1321655