Soldering apparatus for printed circuit board

Details Soldering apparatus for printed circuit board Soldering apparatus for printed circuit board

H - Electricity

05

K

356/22

H05K 3/34 (2006.01) B23K 3/06 (2006.01)

Patent

CA 1193753

SOLDERING APPARATUS FOR PRINTED CIRCUIT BOARD Abstract of the Disclosure An improved soldering apparatus for printed circuit boards includes a first solder tank and a second solder tank provided adjacent each other for storing molten solder. A first nozzle and a second nozzle independent of each other are disposed in the first and second tanks, respectively, and serve to spout molten solder. A printed circuit board is passed sequentially and at an upward incline through solder waves from the first and second nozzles. The arrangement is characterized in that the second nozzle is disposed at a level above that of the first nozzle, the level of the molten solder in the second tank also being disposed higher than that in the first tank. The arrangement provides improved soldering and enables ready adjustment of the optimum spouting heights.

401662

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