Radiation-cured adhesive system containing amides

Details Radiation-cured adhesive system containing amides Radiation-cured adhesive system containing amides

C - Chemistry, Metallurgy

08

F

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C08F 2/50 (2006.01) C08F 4/40 (2006.01) C08F 220/56 (2006.01) C08F 220/60 (2006.01) C08F 283/04 (2006.01) C09J 4/00 (2006.01)

Patent

CA 1297621

ABSTRACT OF THE DISCLOSURE A reactive acrylic adhesive, activated by actinic radiation, includes at least about 0.1 percent by weight of a beta-unsaturated organic amide for enhanced curing speed.

557766

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