Wire/disk board-to-board interconnect device

Details Wire/disk board-to-board interconnect device Wire/disk board-to-board interconnect device

H - Electricity

05

K

356/10

H05K 3/36 (2006.01) H05K 3/32 (2006.01) H05K 3/30 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1291274

ABSTRACT OF THE INVENTION An apparatus and method for creating a stack assembly of print circuit boards and for providing electrical interconnection between the individual through-plated hole pads of the circuit boards is described. The preferred embodiment of the present invention is a device comprised of two parts: a slotted disk and a wire. The slotted disk is attached to the surface of the printed circuit board so as to cover a hole pad and form an electrical connection therewith. The covered holes of the printed circuit board are axially aligned between circuit boards and an electri- cally conducting wire is inserted through the slotted disks on the circuit boards to form an electrical con- nection therewith.

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