Mold method for superconductive joint fabrication

Details Mold method for superconductive joint fabrication Mold method for superconductive joint fabrication

H - Electricity

01

L

327/84

H01L 39/24 (2006.01) H01L 39/02 (2006.01)

Patent

CA 1249039

MOLD METHOD FOR SUPERCONDUCTIVE JOINT FABRICATION Abstract of the Disclosure A method for joining multifilamentary super- conductive wire comprises disposing the ends of the wires in a hot liquid metal stripping bath for removal of the metal matrix. In particular, in the present invention the ends of the wires to be joined are agitated within this bath to assure complete removal of the metal matrix. The liberated superconductive filaments are then disposed in a solder bath and then inserted into a mold which is filled with hot liquid superconductive solder which is allowed to solidify around the filamentary conductors after which the mold is removed.

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