Printed circuit board maximizing areas for component...

Details Printed circuit board maximizing areas for component... Printed circuit board maximizing areas for component...

H - Electricity

05

K

356/16

H05K 3/46 (2006.01) H01P 3/08 (2006.01) H05K 1/02 (2006.01) H05K 3/30 (2006.01) H05K 1/00 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1215475

- 26 - ABSTRACT OF THE DISCLOSURE PRINTED CIRCUIT BOARD MAXIMIZING AREAS FOR COMPONENT UTILIZATION A multilayer printed circuit board for TTL logic components provides an approximate 100 ohm characteristic impedance between external microstrip signal lines and internal ground and voltage planes. The addition of two internal microstrip signal plane lines permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristic.

462076

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