Flex-pack interconnection apparatus

H - Electricity – 05 – K

Patent

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H05K 7/02 (2006.01) H01L 23/14 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01) H05K 7/00 (2006.01)

Patent

CA 1207880

Abstract of the Disclosure Disclosed is a flex pack interconnection apparatus 10 which has eight support members 11 having windows 12 in which circuits are bonded. The support members are all interconnected by a flexible polyimide web and an electrical circuit is etched thereon so as to interconnect the circuits and the external world via a contact tab extending from one of the support wafer members 11.

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