H - Electricity – 01 – B
Patent
H - Electricity
01
B
117/113, 31/156,
H01B 1/22 (2006.01) C08K 3/08 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1254323
- i - Patent Application of F. Wayne Martin and Samson Shahbazi for CONDUCTIVE COMPOSITIONS THAT ARE DIRECTLY SOLDERABLE AND FLEXIBLE AND THAT CAN BE BONDED DIRECTLY TO SUBSTRATES ABSTRACT OF THE DISCLOSURE This invention provides conductive compositions that are solderable and flexible and that can be bonded directly to substrates. These compositions are made up of a combination of silver exclusively in the form of flake and resin system, said resin system comprising of vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardener. Also provided is a method of making these compositions. Another embodiment of this invention is a method of applying conductive compositions directly to substrates by bonding the conductive compositions directly to the substrate. Once cured, the compositions demonstrate good adhesion directly to the substrate in addition to excellent conductivity, solderability and flexibility characteristics.
485268
Martin Frank W.
Shahbazi Samson
Ferro Corporation
Gowling Lafleur Henderson Llp
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