Process for producing printed circuits

Details Process for producing printed circuits Process for producing printed circuits

H - Electricity

05

K

356/1

H05K 3/00 (2006.01) C23C 18/28 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1224276

ABSTRACT OF THE DISCLOSURE The present invention provides a method of manufac- ture of contact switches having conductive coatings of increased adhesive strength and resolution for producing through-contacts in boreholes of printed circuit boards, com- prising the steps of providing a base material, drilling bore- holes in said material, cleaning, activating and reducing said base and producing a coating thereon, and heating-up said base material at temperatures within the range from 100°C to 150°C immediately after said reducing step, said heating-up step being carried out for from 5 minutes to 2 hours, said reducing step being carried out by means of a reducing agent selected from the group consisting of alkaline hypophosphite, sodium borohydride and dimethyl-amino-boron.

476796

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