Copper thick film material systems

Details Copper thick film material systems Copper thick film material systems

H - Electricity

01

C

338/25

H01C 17/06 (2006.01) H01C 17/02 (2006.01) H01C 17/065 (2006.01) H01C 17/24 (2006.01) H01C 17/28 (2006.01)

Patent

CA 1309758

THICK FILM MATERIAL SYSTEM ABSTRACT A material system for manufacturing thick film resistors on a ceramic dielectric substrate is dis- closed. The system includes the application and fixing of resistor terminations composed of a precious conduc- tor material to a dielectric substrate. Resistor material is deposited over portions of the resistor terminations and to the dielectric substrate intermedi- ate the resistor terminations. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are deposited and fixed to the resistor terminations and to portions of the resistor material. The resistor material is trimmed to tolerance by kerfing the resistor material and a dielectric encapsulant is applied substantially over the resistor interconnections and resistor material.

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