Method of connecting a semiconductor to elements of a...

Details Method of connecting a semiconductor to elements of a... Method of connecting a semiconductor to elements of a...

H - Electricity

05

K

356/12, 356/183

H05K 1/02 (2006.01) G06K 19/077 (2006.01) H01L 21/60 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1201821

12 ABSTRACT: A portable card consisting of an entirely insulating support (2), of which a part (7, 8) is very thin with a chip (5) of an integrated circuit arranged so that its metalliza- tions are opposite holes (4) provided in the thin support beforehand. The conducting tracks (9) and the contacts with the integrated circuit are obtained in one operation by means of a conducting paste applied by screen printing, which covers the holes and penetrates into them in order to establish a contact with the chip.

428006

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