Self-contained thermal transfer integrated circuit carrier...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/110

H01L 23/28 (2006.01) H01L 23/367 (2006.01) H01L 23/373 (2006.01) H01L 23/467 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1261482

SELF-CONTAINED THERMAL TRANSFER INTEGRATED CIRCUIT CARRIER PACKAGE ABSTRACT A semiconductor carrier package to accommodate single or multiple integrated circuits. This such package being enhanced with a micro-engineered thermal transfer apparatus which effectively removes the large heat fluxes generated in such applications. Said apparatus being completely self-contained and independent of any external systems of coolant pumps, collection or heat transfer systems. Coolant flow is internally perpetuated by the heat generated by these semiconductor circuit(s) and no moving mechanisms are generally employed. The invention is a spacially compact integrated circuit package unit with minimal mass and high thermal removal efficiencies. The lack of complex components or moving mechanisms also increases the reliability of the package making it virtually maintenance free.

570055

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Self-contained thermal transfer integrated circuit carrier... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-contained thermal transfer integrated circuit carrier..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-contained thermal transfer integrated circuit carrier... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1338026

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.