Rubber-modified epoxy adhesives

Details Rubber-modified epoxy adhesives Rubber-modified epoxy adhesives

C - Chemistry, Metallurgy

08

G

400/4707, 400/59

C08G 59/40 (2006.01) C08G 59/18 (2006.01) C08G 59/22 (2006.01) C08G 59/38 (2006.01) C08G 59/68 (2006.01) C08L 63/00 (2006.01) C09J 4/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1276737

ABSTRACT Epoxy adhesive compositions which are suitable for use in bonding metal and SMC parts to other metal and SMC parts comprise, in admixture, an epoxy resin, the adduct of an epoxy resin and a reactive (meth)acrylonitrile/butadiene rubber and a mixture of Lewis acid complexes having different cure times. The adhesive can be cured at elevated temperatures in 5 minutes or less.

543696

Affiliated with

Also associated with

Rating

Rubber-modified epoxy adhesives does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rubber-modified epoxy adhesives, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rubber-modified epoxy adhesives will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1338895