Adhesive compositions containing low molecular weight...

Details Adhesive compositions containing low molecular weight... Adhesive compositions containing low molecular weight...

C - Chemistry, Metallurgy

09

J

400/5005, 402/51

C09J 133/04 (2006.01) C08F 220/12 (2006.01) C09J 133/08 (2006.01)

Patent

CA 1332776

ADHESIVE COMPOSITIONS CONTAINING LOW MOLECULAR WEIGHT POLYMER ADDITIVES INVENTORS: JUDITH L. WHITMIRE, PATRICIA M. LESKO, and TIMOTHY G. WOOD DN86-06 CWB/tjm ABSTRACT Adhesive compositions containing a polymeric additive which is polymerized from monomers selected from C1-C20 alkyl and cycloalkyl acrylate, C1-C20 alkyl and cycloalkyl methacrylate, free-radical polymerizable olefinic acids, and optionally other ethylenically unsaturated monomers wherein said polymeric additive has a number average molecular weight less than about 35,000 and a softening point greater than about 40°C.

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