Semiconductor device comprising a ferroelectric memory...

G - Physics – 11 – C

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Details

G11C 11/22 (2006.01) H01L 21/77 (2006.01) H01L 27/04 (2006.01) H01L 27/08 (2006.01) H01L 27/10 (2006.01) H01L 27/115 (2006.01)

Patent

CA 2178091

The invention relates to a semiconductor device comprising a semiconductor body (3) with a semiconductor element (1) with an electrically conducting region (5) on which a capacitor (2) forming a memory element is present with a lower electrode (11), an oxidic ferroelectric dielectric (12), and an upper electrode (13), which lower electrode (11) makes electrical contact with the conducting region (5) and comprises a layer with a conductive metal oxide (112) and a layer (111) comprising platinum. The layer with the conductive metal oxide (112) acts as an oxygen barrier during manufacture. The invention also relates to a method of manufacturing such a semiconductor device. According to the invention, the device is characterized in that the layer comprising platinum (111) contains more than 15 atom % of a metal capable of forming a conductive metal oxide, and in that the layer (112) with the conductive metal oxide is present between the layer (111) comprising platinum and the ferroelectric dielectric (12). A good electrical contact between the lower electrode (11) and the conducting region (5) after manufacture is achieved thereby.

L'invention concerne un dispositif semiconducteur qui comprend un corps semiconducteur (3), et un élément semiconducteur (1) doté d'une région conductrice d'électricité (5) sur laquelle on trouve un condensateur, formant une mémoire, qui comporte une électrode inférieure (11), un diélectrique ferro-électrique d'oxydation (12) et une électrode supérieure (13). L'électrode inférieure (11) établit un contact électrique avec la région conductrice (5) et comporte une couche contenant un oxyde métallique conducteur (112) et une couche (111) comprenant du platine. La couche contenant un oxyde métallique conducteur (112) agit comme une barrière contre l'oxygène pendant la fabrication. L'invention concerne aussi un procédé de fabrication d'un tel dispositif semiconducteur. Selon l'invention, ce dispositif se caractérise en ce que la couche (111) contenant du platine renferme plus de 15 % d'atomes d'un métal pouvant former un oxyde métallique conducteur, et en ce que la couche (112) contenant un oxyde métallique conducteur est placée entre la couche (111) contenant du platine et le diélectrique ferro-électrique (12). On obtient ainsi un bon contact électrique entre l'électrode inférieure (11) et la région conductrice (5) une fois la fabrication terminée.

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