Polymide precursor solution, coating film obtained...

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 73/10 (2006.01) C09D 179/08 (2006.01)

Patent

CA 2241492

A polyimide precursor solution having a high concentration yet low viscosity, a polyimide coating film having satisfactory physical properties which is prepared from the polyimide precursor solution, and a process for producing a polyimide coating film using the polyimide precursor solution. The polyimide precursor solution has dissolved therein a specific salt of a diamine and a tetracarboxylic acid and/or a dicarboxylic acid-dialkyl ester in a high concentration, the diamine and the tetracarboxylic acid and/or the dicarboxylic acid-dialkyl ester being capable of forming a polyimide. Also disclosed is a polyimide coating film obtained by heating the solution to cause imidization and a process for producing the polyimide coating film.

Divulgation d'une solution de précurseurs de polyimides, de concentration élevée tout en ayant une faible viscosité; d'un film de revêtement en polyimide ayant des propriétés physiques satisfaisantes, préparé à partir de la solution de précurseurs de polyimides; et d'un procédé pour produire un film de revêtement en polyimide à l'aide de la solution de précurseurs de polyimides. Un sel spécifique d'une diamine et un acide tétracarboxylique et/ou un ester dialkylique d'acide dicarboxylique en concentration élevée se trouvent dissous dans la solution de précurseurs de polyimides. La diamine, l'acide tétracarboxylique et/ou l'ester dialkylique d'acide dicarboxylique peuvent réagir pour former un polyimide.On divulgue aussi un film de revêtement en polyimide, obtenu en chauffant cette solution afin de provoquer l'imidisation, et un procédé pour produire le film de revêtement en polyimide.

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