Sputtering target, low resistivity, transparent conductive...

C - Chemistry – Metallurgy – 04 – B

Patent

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C04B 35/01 (2006.01) C04B 35/117 (2006.01) C04B 35/453 (2006.01) C04B 35/457 (2006.01) C04B 35/495 (2006.01) C23C 14/08 (2006.01)

Patent

CA 2623404

The present invention is directed to a composition consisting essentially of: a) from about 0.1 to about 60 mole % of MoO2, b) from 0 to about 99.9 mole % of In2O3, c) from 0 to about 99.9 mole % of SnO2, d) from 0 to about 99.9 mole % of ZnO, e) from O to about 99.9 mole % of AI2O3, f) from O to about 99.9 mole % of Ga2O3, wherein the sum of components b) through f) is from about 40 to about 99.9 mole %, and wherein the mole %s are based on the total product and wherein the sum of components a) through e) is 100. The invention is also directed to the sintered product of such composition, a sputtering target made from the sintered product and a transparent electroconductive film made from the composition.

La présente invention se rapporte à une composition comprenant essentiellement : a) d~environ 0,1 à environ 60 % de moles de MoO2, b) de 0 à environ 99,9 % de moles de In2O3, c) de 0 à environ 99,9 % de moles de SnO2, d) de 0 à environ 99,9 % de moles de ZnO, e) de 0 à environ 99,9 % de moles de AI2O3, f) de 0 à environ 99,9 % de moles de Ga2O3, dans laquelle la somme des composants b) à f) est égale à environ 40 à 99,9 % de moles environ, et dans laquelle les % de moles sont basés sur le produit total et dans laquelle la somme des composants a) à e) est égale à 100. L~invention se rapporte également au produit fritté d~une telle composition ; une cible d~amincissement par arrachement ionique fabriquée à partir du produit fritté et un film électroconducteur transparent fabriqué à partir de la composition.

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