Methods and apparatus for forming submicron patterns on films

H - Electricity – 01 – L

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H01L 21/033 (2006.01) B05D 3/14 (2006.01) G03F 7/00 (2006.01) H01L 21/027 (2006.01) H01L 21/3105 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2395760

A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface; and hardening the structure in the first flowable medium to form the patterned film.

L'invention concerne un procédé de formation d'un film à motifs sur un substrat consistant à produire un premier milieu fluide sur le substrat et un second milieu fluide sur ledit premier milieu, les premier et second milieux fluides possédant des propriétés diélectriques différentes et définissant une interface, appliquer un champ électrique sur l'interface durant un temps suffisant pour produire une structure dans le premier milieu fluide le long de l'interface, et durcir la structure dans ledit premier milieu pour former le film à motifs.

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