Liquid-coolant cooling element

H - Electricity – 01 – L

Patent

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Details

H01L 23/473 (2006.01) F28D 9/04 (2006.01) F28F 3/12 (2006.01)

Patent

CA 2145081

The invention relates to a liquid-coolant cooling element for cooling heat-generating disk-shaped compo- nents. According to the invention, the liquid-coolant cooling element comprises a main body (2) which is provided with at least one cooling plate (4), which has a cooling channel (24) led in a double spiral, the ends of which channel open respectively into a collecting chamber (18, 20), this main body (2) having at least one inlet and outlet channel (12, 14), which open respectively into a passage bore (16), which are respectively connected in terms of flow to a collecting chamber (18, 20) of at least one cooling plate (4, 32). Thus, using said liquid-coolant cooling element, a plurality of power semiconductor components of different contact surfaces can be cooled at a high packing density.

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