Interface materials and methods of production and use thereof

Details Interface materials and methods of production and use thereof Interface materials and methods of production and use thereof

B - Operations, Transporting

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B

B32B 5/12 (2006.01) B05D 1/14 (2006.01) B05D 1/16 (2006.01) B05D 5/12 (2006.01) B32B 5/06 (2006.01) B32B 27/12 (2006.01) D04H 1/04 (2006.01) D04H 11/00 (2006.01) D04H 13/00 (2006.01) H01L 23/427 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2433637

Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.

L'invention concerne des matériaux d'interface en couches comprenant au moins un composant d'interface thermique réticulable et au moins un composant d'interface fibreux souple couplé au composant d'interface thermique. Un procédé de formation de matériaux d'interface en couches consiste (a) à obtenir un composant d'interface thermique réticulable, (b) à obtenir un composant d'interface fibreux souple, et (c) à coupler physiquement le composant d'interface thermique au composant d'interface fibreux. Au moins une couche supplémentaire comprenant une couche de substrat peut être couplée au matériau d'interface en couches.

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