Printed circuit board for injection molding system

Details Printed circuit board for injection molding system Printed circuit board for injection molding system

B - Operations, Transporting

29

C

B29C 45/27 (2006.01) B29C 45/22 (2006.01) H05K 3/40 (2006.01) B29C 45/76 (2006.01) B29C 45/78 (2006.01)

Patent

CA 2109555

An injection molding station includes a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board associated with the mold manifold plate; and a power source; wherein the at least one printed circuit board electrically connects the power source with the heaters. Each printed circuit board has at least one power layer printed with a plurality of power supply tracks, the power supply tracks being connected at a first end to the power source and at a second end to a respective heater. Each nozzle may also have a respective temperature sensing device, the printed circuit board having at least one sensor layer printed with sensor tracks, the sensor tracks being connected at a first end to a respective temperature sensing device, and at a second end to a controlling device.

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