Stackable multilayer substrate for mounting integrated circuits

Details Stackable multilayer substrate for mounting integrated circuits Stackable multilayer substrate for mounting integrated circuits

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H01L 23/32 (2006.01) H01L 23/00 (2006.01) H01L 23/13 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2024784

11 A STACKABLE MULTILAYER SUBSTRATE FOR MOUNTING INTEGRATED CIRCUITS ABSTRACT OF THE DISCLOSURE A substrate is formed from a core substrate of flexible, low-temperature co-fireable ceramic tape and an outer substrate of ceramic tape having apertures for receiving integrated circuits (ICs) therein. The substrate is heated to form a rigid body which then mounts the ICs. The rigid body and ICs are covered or at least partially covered with an insulating glass and heated to a temperature that fuses the glass but does not harm the ICs. The resulting structure hermetically seals the ICs in a single substrate that is insensitive to acceleration forces.

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