Medium film deposition of electric circuits

Details Medium film deposition of electric circuits Medium film deposition of electric circuits

H - Electricity

05

K

356/12

H05K 1/16 (2006.01) G03F 7/28 (2006.01) H05K 3/10 (2006.01) H05K 1/03 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1155967

MEDIUM FILM DEPOSITION OF ELECTRIC CIRCUITS Abstract of the Disclosure A process for forming microcircuits by exposing a photosensitive organic layer on a substrate to ctive radiation to render part of the layer soft and particle receptive and part of the layer hard and particle non-receptive. Powder having conductive or resistive component is then spread over the layer 9 embedded into the soft material as a multilayer, and removed from the hard material. Finally, the substrate is fired to burn off the organic layer, to sinter the powder particles together and to fuse them to the substrate. The resin must be from 5 to 10 m thick and the powder from 0.5 to 10 m in diameter in order that the film produced by firing does not have voids or blisters. Circuits can be made having much higher resolution than can be achieved using thick film techniques and at a much lower cost than fabricating thin film circuits. - i -

371636

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