Polyamide-epichlorohydrin resin

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 69/48 (2006.01) C08L 77/06 (2006.01) D21H 17/55 (2006.01)

Patent

CA 2041444

R.I.CAN.C-2248 4-23-91 ABSTRACT OF THE DISCLOSURE This invention describes a method for making a thermosetting polyamide-epichlorohydrin wet strength resin which contains substantially reduced amounts of organic-chlorine contaminants while its wet strength property remains comparable to commercial polyamide-epichlorohydrin resins. The reduction of the contaminants is attained by reacting less than the total amount of epichlorohydrin with polyamide at any one time to substantially react all of the epichlorohydrin with the polyamide while retaining a part of the dual reactive functionality of the epichlorohydrin to provide thermosetting wet strength to the resin.

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