Semiconductor chip module and method of manufacturing the same

Details Semiconductor chip module and method of manufacturing the same Semiconductor chip module and method of manufacturing the same

H - Electricity

01

L

H01L 23/433 (2006.01) H01L 21/52 (2006.01) H01L 23/043 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2072377

Abstract of the Disclosure The semiconductor chip module comprises a substrate on which a wiring portion is formed, a semiconductor chip mounted so as to face a circuit side down to the wiring portion, a heat sink with one end in contact with a side opposite to the circuit side of the semiconductor chip, and a cap enclosing the semiconductor chip and having an opening exposing externally the other end of the heat sink. A metal film is formed at least on the inner wall of the opening and on the surface of the heat sink which is inserted into the cap. An adhesive material is filled between the tip portion of the heat sink and the semiconductor chip, while an adhesive material is filled between the metal films.

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