Adhesive formulation

Details Adhesive formulation Adhesive formulation

C - Chemistry, Metallurgy

08

L

400/1709, 400/17

C08L 23/20 (2006.01) C08L 23/22 (2006.01) C09J 123/22 (2006.01)

Patent

CA 1113636

ABSTRACT OF THE DISCLOSURE An adhesive formulation has a desirable balance of high initial tack, good dry strength, good release, and low tack upon ultimate exposure. It is particularly well suited for securing coupons to carbon blanks. The formulation is butyl latex-based and includes a paraffin wax and a lower polyolefin.

296671

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