Polyetherimide-polyamide blend

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/4601

C08L 77/00 (2006.01) C08K 5/00 (2006.01) C08L 21/00 (2006.01) C08L 63/00 (2006.01) C08L 79/08 (2006.01) C08L 23/16 (2006.01) C08L 23/20 (2006.01)

Patent

CA 2022171

AKU 2202 POLYETHERIMIDE-POLYAMIDE BLEND ABSTRACT A resin composition comprising (l) 5 to 95% by weight of a polyetherimide (PEI) and 95 to 5% by weight of a polyamide (PA), (2) 0.01 to 40 parts by weight of (A) a compound having in the molecule both an ethylenically unsaturated carbon- carbon double bond and a carboxylic acid, acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group or (B) an epoxy compound per 100 parts by weight of the total amount of polyetherimide and polyamide resin (1), and (3) 0 to 40 parts by weight of rubbery polymer per 100 parts by weight of the total amount of polyetherimide and polyamide resin (1). The Izod 180-4A impact resistance of these blends is considerably improved as compared with the known blends that do not contain any of the above functionalizing compounds. * * * * *

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